Job Description
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Job Title:  Senior Scientist II, Advanced RF Packaging and Integration, IME
Requisition ID:  2506
Posting Start Date:  29/06/2026

 
We are seeking an RF Scientist to drive innovation in advanced packaging and system integration for next-generation high-frequency devices. This role focuses on the design, modeling, and characterization of RF components within complex packaging architectures. You will contribute to cutting-edge technologies enabling high-performance applications in communications, sensing, and electronics integration.

Key Responsibilities

  • Lead the design and integration of advanced RF packaging solutions (2.5D/3D interposers, FOWLP) for high-frequency and high-performance applications
  • Design and optimize RF components, interconnects, and system-in-package (SiP) architectures
  • Perform EM, signal integrity (SI), and power integrity (PI) simulations to ensure optimal performance (loss, crosstalk, impedance matching)
  • Drive innovation in materials, architectures, and interconnect technologies for heterogeneous integration, including AI and high-performance compute systems
  • Apply data-driven and AI/ML-assisted approaches to modeling, design optimization, and predictive performance/reliability analysis
  • Translate R&D concepts into scalable, manufacturable solutions bridging research and productionLead experimental validation, RF characterization, and reliability analysis, including failure investigation and iterative design improvement
  • Collaborate across multidisciplinary teams to co-design integrated chip–package–system solutions, including photonics, MEMS, and integrated thermal solutions, for next-generation AI, communications, and sensing platforms.
  • Contribute to technology roadmaps, intellectual property (IP) development, and technical publications
     

Required Qualifications

  • PhD or Master’s degree in Electrical Engineering, Applied Physics, or related field
  • Strong background in RF/microwave engineering and electromagnetics
  • Experience with RF simulation tools (e.g., HFSS, CST, ADS, or similar)
  • Knowledge of semiconductor packaging technologies (e.g., flip chip, interposers, fan-out)
  • Experience in RF measurement techniques (VNA, spectrum analyzer, probe stations)
  • Strong analytical and problem-solving skills

Preferred Qualifications

  • Experience with mmWave or high-frequency systems
  • Familiarity with heterogeneous integration and system-in-package (SiP) design
  • Knowledge of materials and thermal/mechanical considerations in packaging
  • Programming or scripting skills (Python, MATLAB, etc.)
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The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.