Job Description

As part of IME’s Silicon Photonics Department, the candidate will drive the development of next-generation, low-power photonic engines. The candidate will be a key contributor to our Co-Packaged Optics (CPO) initiatives, focusing on high-efficiency Silicon (Si) Ring Modulators. This role sits at the intersection of chip design and system-level integration, requiring close collaboration with EIC and packaging teams.

Job Responsibilities:

• Lead the design, simulation, and testing of high-speed, ultra-low-power Silicon Ring Modulators.
• Define performance metrics for low-power photonic engines to meet CPO energy-efficiency and bandwidth targets.
• Work with Electrical IC (EIC) designers to co-simulate and optimize the driver-to-modulator interface.
• Partner with advanced packaging teams to ensure signal integrity and thermal management in CPO architecture.
• Drive the optical characterization and system-level testing of fabricated photonic integrated circuits (PICs).

Job Requirements:

• Hold a PhD in science or engineering (or an equivalent qualification), preferably with a focus on photonic device development.

• Strong experience in semiconductor processing, integration and packaging, and familiarity with industrial level module is a strong advantage.

• Strong analytical, problem-solving, and research skills with a track record of publications.
• A proactive, hands-on mindset with demonstrated initiative, adaptability, and strong problem-solving skills in a dynamic environment.
• Strong communication and presentation skills are essential, along with the ability to work independently and collaborate effectively within a team.