RnD Scientist Co Packaged Optics

Job Description
Develop package level optical interconnects for advanced Co Packaged Optics CPO platforms using fan out silicon interposer polymer glass or 3D stacking technologies interfacing with various optical coupling schemes
Simulate the impact of hybrid bonding interfaces package stacks and other packaging elements on optical signal transmission
Design silicon and alternative material lenses for optical IOs in wafer scale integration
Estimate optical losses between grating couplers edge couplers and fiber interfaces through lens structures
Design package level and wafer level optical interconnects between GPU to GPU and GPU to memory for multi chiplet heterogeneous integration packages
Develop passive fiber alignment structures and techniques for high density optical coupling
Evaluate fiber array assemblies with CPO test vehicles
Generate package design and test plans to prototype and validate process flows
Characterize fabricated structures using optical testing and metrology tools
Propose innovative ideas to advance the state of the art in optical interconnects and testing




Job Requirements
Strong background in optical interconnect modeling
Understanding of passive alignment techniques for fiber to chip coupling such as V grooves alignment pins and trench structures
Understanding of optical loss mechanisms alignment tolerances and packaging induced misalignments
Knowledge of wafer level processes such as lithography DRIE plasma etching wafer bonding and dicing
Familiarity with photonic packaging platforms such as SiPh InP and TFLN and coupling interfaces such as edge couplers and grating couplers
Proficiency in microscope based alignment metrology and optical loss measurements
Strong communication teamwork and technical reporting skills
MS or PhD in Engineering Physics or a related field