Job Description

Job Responsibilities:
- Support optical interconnect integration using 2.5D and 3D advanced packaging approaches.
- Understand and generate package design layouts, process-flow concepts, test vehicle plans, and validation strategies.
- Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners.
- Develop advanced package-level and wafer-level optical interconnect solutions for Co-Packaged Optics (CPO) and heterogeneous integration platforms.
- Perform optical simulation and analysis to assess coupling loss, alignment tolerance, package-stack effects, and interface-related optical performance.
- Design and evaluate optical coupling structures, including grating-coupler, edge-coupler, lens-assisted, and fiber-array-based interfaces.
- Develop passive fiber alignment concepts and detachable low-loss optical connector schemes for high-density optical I/O integration.
- Contribute to optical interconnect architectures for GPU–GPU, GPU–memory, and multi-chiplet system-level packaging applications.
- Perform optical and electro-optical characterization of fabricated structures, including optical loss, coupling efficiency, high-speed modulation response, eye-diagram, and link-level performance evaluation.
- Support package-level electro-optical testing of optical interconnect test vehicles using relevant optical, RF, and high-speed measurement setups.
- Propose new concepts to improve optical coupling efficiency, alignment tolerance, manufacturability, and testability of next-generation CPO platforms.

Requirements
- Strong understanding of optical interconnect integration and advanced packaging concepts for Co-Packaged Optics (CPO) and heterogeneous integration platforms.
- Knowledge of optical coupling mechanisms, optical loss sources, alignment tolerances, and package-induced optical performance variations.
- Familiarity with photonic integration platforms such as Silicon Photonics (SiPh), Indium Phosphide (InP), and Thin-Film Lithium Niobate (TFLN), including edge-coupler and grating-coupler interfaces.
- Understanding of passive and active optical alignment approaches for fiber-array and chip-level optical coupling structures.
- Knowledge of wafer-level and package-level fabrication processes, including lithography, plasma etching, wafer thinning, bonding, molding, and dicing processes.
- Familiarity with optical simulation and analysis tools for evaluating coupling efficiency, alignment sensitivity, and optical interface performance.
- Understanding of optical and electro-optical characterization techniques, including optical loss measurement, high-speed modulation testing, eye-diagram evaluation, and package-level optical testing.
- Familiarity with microscope-based inspection, metrology, and laboratory characterization.
- Ability to support process integration activities, and collaboration with internal teams and external partners.
- Strong analytical, problem-solving, communication, teamwork, and technical documentation skills.