Job Description

Senior Research Engineer/ Research Engineer, Advanced Packaging

IME's Advanced Packaging Programme is looking for a passionate Engineer to drive prototyping and small-volume manufacturing activities using state-of-the-art packaging platforms such as fan-in/fan-out wafer-level packaging, 2.5D interposers, and W2W/C2W 3D integration. The successful candidate will play a key role in developing innovative package architectures, advancing technology demonstrations, and working closely with researchers and industry collaborators to translate concepts into functional prototypes. The role focuses on delivering high-quality products, ensuring process stability, coordinating manufacturing operations.

Job Responsibilities

· Plan, coordinate, and execute prototype and small-volume manufacturing runs using advanced packaging technologies, including Fan-In/Fan-Out Wafer Level Packaging (FOWLP), 2.5D interposers, and W2W/C2W 3D integration.

· Develop manufacturing plans, process flows, and work instructions to meet customer and project requirements.

· Monitor production activities, troubleshoot process issues, and implement corrective actions to improve yield, quality, and cycle time.

· Work closely with process, equipment, and quality engineers to ensure stable and repeatable manufacturing performance.

· Coordinate wafer and material logistics, production scheduling, and resource allocation to ensure on-time delivery.

· Perform process monitoring, yield analysis, failure analysis, and root-cause investigations.

· Support customer prototype builds, engineering lots, and qualification activities.

· Drive continuous improvement initiatives to enhance manufacturing efficiency, quality, and operational excellence.

· Maintain manufacturing documentation, including process specifications, manufacturing reports, and quality records.

· Ensure compliance with safety, quality, and operational procedures.

Job Requirements

• Bachelor's, Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Microelectronics, or a related discipline.
• 2-3 years of experience in semiconductor manufacturing, advanced packaging, process integration, or related fields.
• Fresh graduates with a strong interest in semiconductor packaging and manufacturing are also encouraged to apply.
• Knowledge of semiconductor packaging processes such as lithography, plating, RDL formation, wafer thinning, bonding, molding, and assembly is advantageous.
• Hands-on experience in prototype builds or low-volume manufacturing environments.
• Knowledge in 2.5D/3D IC integration, hybrid bonding, chiplet packaging, or heterogeneous integration technologies; is an advantage 
• Experience with manufacturing execution systems (MES), quality management systems, and process qualification methodologies
• Familiarity with statistical process control (SPC), yield analysis, and problem-solving methodologies.
• Strong analytical, troubleshooting, and data analysis skills.
• Ability to work effectively in a multidisciplinary team environment and interact with internal and external stakeholders.
• Excellent communication and project coordination skills.