Job Description

We are seeking a highly skilled and experienced Device Module and Integration Engineer with expertise in semiconductor process modules such as bonding/debonding, PVD, metallization, CMP, and etching to join our dynamic team. 

Responsibilities:

• Develop and optimize SiC device process modules and integration flows.
• Develop processes for bonding/debonding, PVD metallization, metal etching, CMP, and BEOL
• Conduct experiments, analyze data, and optimize processes for device performance and yield.
• Troubleshoot process and integration issues and perform root-cause analysis.
• Collaborate with cross-functional teams for process development and integration.
• Document processes, maintain records, and prepare SOPs.
  

Requirements

• Diploma, Bachelor’s or Master’s in Electronics Engineering, Materials Science, Physics, or related field. 2–3 years of experience in semiconductor process/module integration.
• Knowledge of PVD, RIE/ICP etching, CMP, metallization, bonding/debonding, and BEOL processes.
• Experience in SiC device fabrication is a plus.
• Familiarity with cleanroom protocols and semiconductor manufacturing processes.
• Strong problem-solving, communication, and teamwork skills.
• Fab or semiconductor R&D experience will be an advantage.