Long Description
About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced packaging technologies for next-generation heterogeneous integration. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, chiplet integration, co-packaged optics, and advanced power module packaging. At IME, you will have access to state-of-the-art semiconductor packaging facilities and play a key role in developing innovative assembly solutions for future electronic systems.
Position Overview
We are seeking a highly motivated Research Engineer / Senior Research Engineer to develop, optimize, and integrate advanced assembly processes focusing on die attach, wire bonding, and flip chip technologies. The successful candidate will contribute to cutting-edge semiconductor packaging programs, enabling next-generation high-performance, high-reliability package solutions for diverse applications.
Project Collaboration
(1) Work closely with multidisciplinary teams including process integration, reliability, materials, design, and characterization engineers to deliver project objectives.
(2) Support customer engagements, joint development projects, and industry collaborations through technical discussions and experimental execution.
Key Responsibilities
(1) Develop and integrate advanced die attach, wire bonding, and flip chip assembly processes FOWLP, 2.5D/3D integration, chiplet packaging, photonics, and power electronics applications.
(2) Evaluate emerging assembly materials, interconnect technologies, and equipment capabilities to enhance package performance, reliability, and manufacturability.
(3) Conduct feasibility studies, to support new process development and platform expansion.
Establish Robust Process Solutions.
(1) Design and execute Design of Experiments (DOE) to optimize process parameters, material selection, and assembly recipes.
(2) Develop process control methodologies, characterization plans, and defect reduction strategies to improve yield, reliability, and throughput.
Intellectual Property and Technical Contributions.
(1) Generate detailed engineering reports, technical publications, and presentations to communicate research findings.
(2) Contribute to the development of intellectual property (IP), patents, and technical know-how in advanced semiconductor assembly technologies.
Customer and Market Engagement
(1) Collaborate with internal and external stakeholders to understand future packaging trends and customer requirements.
(2) Develop assembly capabilities that address emerging industry needs in heterogeneous integration, AI computing, photonics, and advanced power applications.
Requirements:
(1) Bachelor's, or Master's in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Manufacturing Engineering, or a related discipline.
(2) Relevant experience in semiconductor assembly processes, including die attach, wire bonding, flip chip bonding, thermocompression bonding, or advanced packaging development.
(3) Strong analytical and problem-solving skills with a hands-on approach to process development.
Ability to work effectively in a multidisciplinary research and development environment.
Application Process
Interested candidates should submit their resume and a cover letter detailing their relevant experience, technical expertise, and contributions to semiconductor assembly or advanced packaging technologies.