We are seeking a Lead Research Engineer to drive the development of advanced wafer pre-assembly processes, including backgrinding, wafer thinning, edge trim, dicing, and singulation technologies for next-generation semiconductor and advanced packaging applications.

Key Responsibilities:

Technical Leadership & Project Management
•    Lead and mentor a team of engineers in developing advanced wafer pre-assembly technologies.
•    Define technical roadmaps and align process development with industry and customer requirements.
•    Initiate, plan, and execute R&D projects, including collaborations with equipment and material suppliers.
•    Drive process transfer from development to pilot manufacturing environments.

Process Development
•    Develop and optimize wafer backgrinding, stress relief, edge trim, dicing, and singulation processes.
•    Evaluate and qualify new grinding wheels, dicing blades, laser dicing technologies, tapes, and consumables.
•    Optimize process performance for wafer thickness control, TTV, edge quality, chipping, wafer warpage, and yield.
•    Address integration challenges associated with ultra-thin wafers, compound semiconductors, MEMS, photonics, and advanced packaging applications.

Characterization & Failure Analysis
•    Conduct process characterization and performance evaluation using metrology and inspection tools.
•    Investigate wafer breakage, micro-cracks, edge chipping, particle generation, and singulation-related defects.
•    Analyze process and yield data to identify root causes and implement corrective actions.
•    Work closely with integration, reliability, and manufacturing teams to resolve process issues.

Innovation & Collaboration
•    Generate technical reports, patents, publications, and intellectual property.
•    Collaborate with equipment vendors, material suppliers, and research partners to develop next-generation solutions.
•    Support business development activities by engaging customers and translating industry challenges into R&D programs.
•    Mentor junior engineers and contribute to building organizational capabilities.

Qualifications:
•    Bachelor's Degree or Master Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Physics, or a related discipline.
•    Minimum 8-10 years of experience in semiconductor process development.
•    Hands-on experience in backgrinding, wafer thinning, stress relief, edge trim, dicing, and singulation processes.
•    Strong understanding of wafer handling, defect control, process integration, and advanced packaging technologies.
•    Experience with failure analysis, DOE, statistical process control, and semiconductor metrology.
•    Proven track record in leading technical projects and working with cross-functional teams.