Job Title: Advanced Packaging Module Senior Research Engineer

Position Overview: We are seeking a highly skilled and motivated Research Engineer / Senior Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Key Responsibilities:

• Innovative Process Development: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding through pathfinding, feasibility assessment, technical risk evaluation, and capability development focusing on pre-assembly processes such as Automated Optical Inspection, backgrinding, dicing and IR metrology.
• Evaluation and Characterization: Plan, coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
• Project Collaboration: Work closely with project leaders, integration team and stakeholders  to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
• Intellectual Property and Reporting: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and technical Know-how (KHs). Strengthen the IP portfolio related to heterogeneous integration.
• Mentorship and Leadership: Provide guidance and support to less experienced colleagues. Lead small-scale projects, managing risks and resource allocation effectively.
• Customer and Market Engagement: Collaborate with internal and external stakeholders to understand future technology needs and develop the necessary capabilities to support them.

Requirements:

• Educational Background: Master’s degree or Bachelor’s degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience: Minimum of 5 years of experience in process development or packaging R&D, with a strong track record in advanced packaging technologies.
• Preferred Skills: Experience in backgrinding, dicing, and pre-assembly processes is highly desirable.

Why Join Us?

• Cutting-Edge Research: Engage in pathfinding research with the latest packaging technologies.
• Professional Growth: Gain access to advanced tools and collaborative opportunities to advance your career.
• Impactful Work: Contribute to significant advancements in semiconductor packaging that drive the industry forward.

Application Process: Interested candidates should submit their resume and a cover letter detailing their relevant experience and research interests.