Job Summary

The Packaging & Testing Engineer supports translational semiconductor research by bridging advanced packaging process development with industry-relevant manufacturing practices. The role focuses on operational engineering control of back-end processes—including backgrinding, wafer dicing, molding, and package-level testing—within a research fab, pilot line, or packaging development environment.

The engineer ensures process robustness, yield performance, and scalability for transfer to industrial partners, while maintaining operational discipline comparable to leading semiconductor assembly and test facilities (OSATs and IDMs).

This position plays a key role in enabling advanced packaging integration, reliability validation, and high-yield manufacturing through joint development programs (JDPs) and technology transfer activities.

Roles & Responsibilities

1. Packaging Process Operations & Control

• Own day-to-day operational engineering control of back-end processes including wafer backgrinding, dicing, molding, encapsulation, and singulation.
• Establish and maintain process control frameworks e.g. SPC, control plans, excursions, process limits with a balance between R&D flexibility and production discipline.
• Monitor and control key KPIs including wafer thickness uniformity, die strength, chipping, cracking, mold voids, warpage, package yield, and defectivity.
• Perform rapid troubleshooting, root cause analysis, and corrective actions to maintain tool uptime and process stability.

2. Test Operations & Yield Analysis

• Support electrical test operations, wafer sort and or final test to validate package integrity and performance.
• Analyze test data to identify failure modes, yield loss mechanisms, and process-related defects.
• Collaborate with process and integration teams to correlate test results with upstream fabrication and packaging conditions.

3. Translational Research Enablement

• Enable research-to-manufacturing transition by ensuring packaging and test processes are scalable, repeatable, and cost-effective.
• Support co-development activities with industry partners on advanced packaging flows and reliability validation.
• Provide engineering input on integration trade-offs involving mechanical strength, thermal performance, and electrical reliability.

4. Tool Performance & Capability Development

• Support qualification, baseline setup, and process optimization of backgrinding, dicing, molding, and test equipment.
• Collaborate with Equipment Engineering and vendors on tool characterization, maintenance strategies, and hardware improvements.
• Support introduction of new materials e.g., molding compounds, tapes and equipment upgrades with appropriate risk assessment.

5. Process Integration, Reliability & Improvement

• Ensure process integration across back-end steps to minimize defects, stress-induced failures, and yield loss.
• Analyze inline and end-of-line data e.g., inspection, warpage metrology, electrical test to identify trends and reliability risks.
• Drive continuous improvement in yield, process stability, throughput, and reliability performance.

6. Industry Collaboration & Technology Transfer

• Work closely with industry partners, OSATs, IDMs to align packaging flows, process conditions, and test methodologies.
• Support technology transfer activities, including documentation, baseline definition, and readiness assessment.
• Participate in technical reviews, cross-functional discussions, and joint problem-solving initiatives.

7. Documentation, Governance & Knowledge Sharing

• Maintain comprehensive process documentation, SOPs, and experimental run plans.
• Generate clear engineering reports summarizing process performance, yield trends, and corrective actions.
• Contribute to best practices for packaging and test operations within research and industry-facing programs.

Requirements

Required Qualifications

• Bachelor’s degree or higher in Mechanical Engineering, Materials Science, Electrical Engineering, Chemical Engineering, or related disciplines.
• 3–5 years of experience in semiconductor packaging and or testing, with hands-on exposure to backgrinding, dicing, and molding processes.
• Strong understanding of back-end fundamentals: wafer thinning, die singulation, encapsulation, stress/warpage, and reliability concerns.
• Experience in yield analysis, SPC, DOE, and failure analysis methodologies.
• Proficiency in data analysis tools e.g., JMP, Python, Excel.

Preferred / Added Advantages

• Experience with advanced packaging technologies e.g., fan-out, flip-chip, WLCSP, 2.5D, 3D integration.
• Familiarity with failure analysis techniques e.g., SEM, X-ray, CSAM, cross-sectioning.
• Knowledge of thermal/mechanical reliability testing e.g., TCT, HTOL, moisture sensitivity.
• Exposure to industry collaborations, OSAT environments, or technology transfer programs.
• Strong communication skills across process, test, and integration teams.

Key Attributes for Success

• Strong yield and reliability-driven mindset
• Ability to balance process discipline with development agility
• Structured, data-driven problem solving approach
• Collaborative and cross-functional orientation
• High ownership in delivering robust, scalable packaging solutions