Job Description

Job Responsibilities:

• Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for advanced packaging applications.
• Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance.
• Serve as a subject matter expert, supporting integration teams with technical insights and recommendations.
• Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules.
• Prepare and deliver technical reports and presentations for both internal stakeholders and external customers.

Job Requirements:

• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, and Microelectronics, or related fields.
• 3+ years direct experience in semiconductor thin film module, preferably in PECVD module.
• Good understanding of thin film deposition techniques and thin film property characterization is desired.
• Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired.
• Understanding of thin film tool hardware is advantageous.
• Hands-on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry is advantageous.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.