About the Role

A*STAR Institute of Microelectronics (IME) is seeking a highly motivated Scientist / Senior Scientistto conduct R&D in thermal management, heat dissipation, and advanced cooling technologies fornext-generation semiconductor packaging. The successful candidate will develop innovativethermal solutions for heterogeneous integration, AI/HPC packages, chiplets, 2.5D/3D integration,power electronics, and photonics applications.
This role involves adopting advanced thermal/cooling concepts into package technologies through close collaboration with multidisciplinary teams in materials, packaging integration, reliability,simulation, and industry partners. He/she focuses on practical execution of thermal R&D activities,including simulation, testing, data analysis, prototype evaluation, and implementation of innovativethermal solutions for next-generation packages such as AI/HPC, chiplet, 2.5D/3D integration,photonics, and power electronics.

Key Responsibilities

1. Thermal Project Execution:
To execute thermal engineering tasks for grant and/or customer-funded R&D projects. To Support project deliverables, timelines, experiments, and reporting. ToPerform package thermal assessments and identify hotspot / cooling issues. To Generate technicaldata, reports, and presentation materials.
2. Thermal Simulation & Analysis:
To conduct thermal modelling using tools such as ANSYSIcepak, ANSYS Fluent COMSOL Multiphysics and SIEMENS Flotherm. To perform steady-stateand transient thermal simulations, junction temperature prediction and thermal resistanceextraction, and thermal design optimization
3. New Cooling Technology Development:
To support development and validation of newcooling concepts, including microchannel cooling, vapor chamber integration, immersion coolingand high-performance TIMs. To build prototypes and conduct proof-of-concept testing.
4. Thermal Characterization & Lab Work:
To perform laboratory thermal measurements with IRthermography, thermocouple, thermal transient testing and flow / pressure drop testing. To correlatemeasured data with simulation results.
5. Cross-functional Collaboration:
to work with package design, process integration, materials,and reliability teams. To support customer technical discussions and project reviews. To contributeto publications, patents, and technical proposals.

Requirements

• PhD / master’s degree in mechanical engineering, materials science, electrical engineering,microelectronics, thermal sciences and related disciplines.
• 2+ years’ work experience in thermal management for semiconductor packaging preferred.
• Strong background in semiconductor package thermal design, electronics cooling, CFD /thermal modeling, experimental thermal characterization and materials for heat dissipation
• Strong understanding of heat transfer, fluid mechanics, semiconductor packaging flows andAI/HPC package challenges
• Experience in simulation tools and data analytics.
• Familiarity with JEDEC standards is advantageous.
• Strong communication and technical presentation skills.
• Strong industry engagement mindset.