Job Description:

• Developing and optimizing Atomic Layer Deposition (ALD) process for Advanced Packaging, Wide-Band-Gap Devices (WBG) and Photonics applications.
• Thin film property characterization and process issue troubleshooting.
• Develop film defect reduction and yield improvement strategies.
• Act as a subject matter expert and resource for colleagues in integration teams.
• Work with fab team in establishing statistical process control for thin film module.
• Generate and present reports to both internal and external customers.

Requirements:

• Ph.D in Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, and Microelectronics, or closely related fields are welcome to apply.
• 3+ years direct experience in semiconductor thin film module, preferably in ALD module.
• Good understanding of thin film deposition techniques, defect reduction methodologies, Yield improvement and thin film property characterization is desired.
• Experience with basic film characterization techniques such as Ellipsometry, FTIR, XPS, SIMS, etc.
• Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired.
• Understanding of thin film tool hardware is advantageous.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.