Job Description

Job Responsibilities:

• Develop and sustain Dry etch processes in R&D and Small volume manufacturing environment.
• Responsible for performing professional process engineering research, from the concept to the final process development for a wide variety of materials. (Metals, Silicon, Dielectrics, SiC and other speciality materials)
• Responsible for metal and oxide layers etch with devices integration on top of metasurface and electrical isolation at unit cell level for sub-100nm technology.
• May conceive and plan projects involving the definition and selection of new materials, concepts and approaches in the processing or developing of new processes.
• Compiles and evaluates test data to determine appropriate limits and variables for process specifications.
• Championing engineering experiments for process characterization to drive quality and yield improvement.
• Set up and collect the experimental data and generate reports for internal and customer distribution.
• Design and complete DOE (Design of Experiments) evaluations to characterize process window for new requirements.
• Work closely with senior staff and process integrators to understand technology roadmaps, process capability requirements and business issues/ challenges.
• Act as a resource for colleagues with less experience; lead small projects with manageable risks.
• Act as subject matter expert for both internal and external stakeholders.
• Accelerate parallel process development capability to meet aggressive project timelines and supporting faster innovation cycles.
• Build a sustainable talent pipeline across both research and engineering levels.

Job Requirements:

• PhD in Materials Science, Metallurgy, Electrical, Electronics, Chemical Engineering, Chemistry or Physics; or relevant field science and engineering fields.
• Candidates with plasma or semiconductor process exposure are added advantages.
• Prior experience in dry RIE etch processes is preferred.
• Knowledge of plasma fundamentals is an added advantage.
• Hands-on experience in designing and executing experiments (DOE), statistical and cause analysis, and problem-solving methods.
• Possess good interpersonal and communication skills.

Job Responsibilities:

• Develop and sustain Dry etch processes in R&D and Small volume manufacturing environment.
• Responsible for performing professional process engineering research, from the concept to the final process development for a wide variety of materials. (Metals, Silicon, Dielectrics, SiC and other speciality materials)
• Responsible for metal and oxide layers etch with devices integration on top of metasurface and electrical isolation at unit cell level for sub-100nm technology.
• May conceive and plan projects involving the definition and selection of new materials, concepts and approaches in the processing or developing of new processes.
• Compiles and evaluates test data to determine appropriate limits and variables for process specifications.
• Championing engineering experiments for process characterization to drive quality and yield improvement.
• Set up and collect the experimental data and generate reports for internal and customer distribution.
• Design and complete DOE (Design of Experiments) evaluations to characterize process window for new requirements.
• Work closely with senior staff and process integrators to understand technology roadmaps, process capability requirements and business issues/ challenges.
• Act as a resource for colleagues with less experience; lead small projects with manageable risks.
• Act as subject matter expert for both internal and external stakeholders.
• Accelerate parallel process development capability to meet aggressive project timelines and supporting faster innovation cycles.
• Build a sustainable talent pipeline across both research and engineering levels.

Job Requirements:

• PhD in Materials Science, Metallurgy, Electrical, Electronics, Chemical Engineering, Chemistry or Physics; or relevant field science and engineering fields.
• Candidates with plasma or semiconductor process exposure are added advantages.
• Prior experience in dry RIE etch processes is preferred.
• Knowledge of plasma fundamentals is an added advantage.
• Hands-on experience in designing and executing experiments (DOE), statistical and cause analysis, and problem-solving methods.
• Possess good interpersonal and communication skills.