Job Description

We are seeking a highly motivated Scientist to join our research team in the field of heterogeneous integration and advanced packaging in the Flat Optics Department under Semiconductor Flagship Initiative. The scientist will develop cutting-edge D2W (die-to-wafer) bonding processes for advanced optoelectronic devices including metasurfaces.

Key Responsibilities

• Develop die-to-wafer bonding processes (e.g. surface preparation, plasma activation, high-accuracy placement).
• D2W, W2W bonding of optical structures with cameras and micro-LED displays.
• Electrical testing of devices, and optimization of process to improve yield and alignment precision
• Work with equipment and material team to develop bonding methods 
• Contribute to intellectual property generation through invention disclosures and patent applications.
• Support translational research and collaborations with industry partners.

Qualifications

• Ph.D. in Physics, Materials Science, Photonics, Electrical Engineering or a related field.
• Advanced packaging, specifically die-to-wafer, wafer-to-wafer, or hybrid bonding.
• Understanding of bond interface physics, alignment/overlay fundamentals
• Strong analytical, experimental, and problem-solving skills
• Good team player who can collaborate with industry and academic partners.

Preferred Qualifications

• Experience in cleanroom processes, e.g. thin film deposition, photolithography
• Experience in imaging sensors and micro-displays
• Track record of publications in relevant fields.