Job Responsibilities:

• Support the development, optimization, and sustaining of electroplating processes (Cu TSV/Damascene/RDL/Pillar, UBM, micro-bump) in both R&D and small-volume manufacturing environments.
• Conduct process characterization, qualification, and continuous improvement activities to meet technology and manufacturing requirements.
• Troubleshoot electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues) using systematic root cause analysis and data-driven methodologies.
• Design and execute Design of Experiments (DOE) to establish process windows, evaluate new plating chemistries, materials, and emerging technologies.
• Compile, analyze, and interpret experimental data to develop process specifications, control plans, and technical recommendations.
• Generate comprehensive technical reports, presentations, and documentation for internal stakeholders and customers.
• Collaborate closely with senior engineers, scientists, process integrators, and cross-functional teams to align process development with technology roadmaps and product requirements.