Short Description

Scientist/Senior scientist will be part of heterogeneous integration group focused on development of the quantum packaging technology platforms to integrate qubit and control chip on superconductivity interposer.

 He/she will work with cross functional team to

• Design and simulation of superconducting circuits for salable quantum processors in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detectors.
• Design and layout of circuits components of a superconducting qubit.
• Process development for quantum packaging. Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on simulation results.
• Prepare competitive grant research proposals and lead execution of these proposals.
• Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

 He/she will work with cross functional team to

• Design and simulation of superconducting circuits for salable quantum processors in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detectors.
• Design and layout of circuits components of a superconducting qubit.
• Process development for quantum packaging. Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on simulation results.
• Prepare competitive grant research proposals and lead execution of these proposals.
• Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms. 

Job Requirements:

• Master/PhD in quantum computing; Electrical and Computer Engineering; Material science area
• 4 to 5 years’ experience in superconducting circuits design and simulation for scalable quantum processors. Deep understanding of 3D quantum package
• Working experience on measuring loss and dielectric constants of materials at cryogenic temperatures
• Effective communication, industry awareness, and critical thinking skills.