Job Description

Job Responsibilities:

• Support developing and sustaining electroplating processes (Cu TSV/Damascene/ RDL/Pillar, UBM, micro-bump) in both R&D and small volume manufacturing environments.
• Support troubleshooting, root cause analysis for electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues).
• Design and perform DOEs to define process windows, characterize new requirements, and evaluate plating chemistries, technologies.
• Compile, analyse, and interpret test data to establish process specifications.
• Generate comprehensive technical reports for both internal teams and customers.
• Collaborate closely with senior engineers, process integrators, and cross-functional teams to align with technology roadmaps and process capability requirements.
  
  

Job Requirements

• Bachelor's or higher degree in Materials Science, Chemical Engineering, Chemistry, or related fields.
• Knowledge of electroplating process is a plus.
• Hands-on experiences in electroplating or related processes are preferred.
• Solid knowledge of experimental design (DOE), data analysis, and problem-solving methodologies (e.g., statistical analysis, root cause analysis).
• Excellent interpersonal, communication, and teamwork skills, with the ability to collaborate across disciplines.
• Self-motivated, resourceful, and capable of managing multiple priorities in a dynamic R&D setting.