Job Description

Responsibilities:

• Support the development of thin film deposition, etching, wet cleaning, wafer bonding and release process modules to enable the fabrication of innovative MEMS devices.
• Collaboration with process integration team to establish manufacturable fabrication procedures and perform basic process tuning.
• Work closely with the equipment engineering team to identify hardware issue and carry out basic troubleshooting of faulty equipment.
• Perform routine metrology measurements to monitor and ensure stable process performance.

Requirements:

• Diploma or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of semiconductor or MEMS related working experience is advantageous.
• Experience in thin film deposition, etching, wet cleaning, wafer bonding or release process is desired.
• Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired
• Hands-on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry is advantageous.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.