Job Description
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Job Title:  Research Engineer (Heterogeneous Integration), IME
Requisition ID:  1401
Posting Start Date:  07/04/2026

Job Description

About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics. At IME, you’ll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.

Position Overview: We are seeking a highly motivated Research Engineer to shape and advance next-generation semiconductor packaging processes. This role offers hands-on involvement in cutting-edge technologies and the opportunity to contribute to high-impact projects that push the frontiers of advanced packaging.

 

Key Responsibilities:

  • Innovative Process Development: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
  • Evaluation and Characterization: Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
  • Project Collaboration: Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
  • Intellectual Property and Reporting: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
  • Customer and Market Engagement: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

 

Requirements:

  • Educational Background: Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, Electrical Engineering, or a related field.
  • Experience: Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is an added advantage. 

 
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The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.