Research Senior Engineer - Wafer-to-Wafer Bonding Engineer (APM)

   Advance the Next Generation of Semiconductor Packaging
   We are seeking a motivated Wafer-to-Wafer Bonding Engineer to join our multidisciplinary R&D team to support the development of advanced wafer        bonding technologies for next-generation semiconductor packaging. This role involves hands-on process development, wafer characterization and close collaboration with cross-functional teams to enable innovative packaging solutions.

Key Responsibilities

• Development and optimization of wafer-to-wafer bonding processes, including hybrid bonding and temporary bonding/debonding.
• Execute process DOE to improve process performance, yield, and reliability.
• Perform wafer inspection and characterization using metrology and failure analysis techniques.
• Investigate process issues and implement corrective actions through systematic data analysis and root-cause investigation.
• Collaborate with design, process integration, materials, and equipment teams to support R&D projects.
• Prepare short-loop wafers and support process integration activities for technology development.
• Document process recipes, experimental results and reports while maintaining accurate engineering records.
• Contribute to publication, know-how and intelligence invention. 

Qualifications
• Bachelor’s or Masters’ degree in Materials Science, Electronics, Electrical Mechanical, Chemical Engineering, Physics, or a related discipline. Fresh graduates with a passion for semiconductor process development are encouraged to apply.
• Hands-on experience in semiconductor wafer process development, advanced packaging, wafer bonding, or related cleanroom processes is preferred.
•  Strong analytical and problem-solving skills 
•  Good communication and teamwork skills 
•  Ability to work in cleanroom environment and handle precision equipment