Job Responsibilities

• Assist advanced packaging process integration activities in day‑to‑day lots processing and execution.
• Closely work with advanced process module team and FAB operations team to coordinate process development experiments, process runs and change implementations.
• Perform wafer inspection and measurements between process modules and flag potential process issues or risks.
• Documentation of process flows, experiment conditions, and observations.
• Operate basic metrology tools (e.g., thickness measurement, CD measurement, inspection tools) according to standard operating procedures (SOPs).
• Collect, organize, and validate metrology and process data accurately and consistently.
• Conduct basic sanity checks on metrology results and escalate anomalies or equipment issues promptly.
• Work closely with engineers, technicians, and cross‑functional teams.
• Follow safety, cleanroom, and quality procedures at all times.
• The candidate should be able to support process integration and metrology through staggered shift work.

Job Requirements

• Diploma in Engineering (e.g., Semiconductor Technology, Electronics, Materials Science, Mechanical, Chemical, or related disciplines).
• Basic understanding of semiconductor manufacturing or process integration concepts.
• Hands-on experience or knowledge in semiconductor metrology and characterization techniques is an advantage.
• Able to work in cleanroom or R&D laboratory environments.
• Proficient in Microsoft Excel, PowerPoint, and Word; basic data analysis skills preferred (e.g., JMP, Minitab)
• Ability to follow SOPs and technical instructions accurately.
• Able to work independently as well as in a team environment.
• Willingness to learn and adapt in a fast‑paced technical setting.
• Prior internship or hands‑on experience in manufacturing, laboratory, or cleanroom environments.
• Basic knowledge of statistical concepts or data visualization tools is a plus.