Long Description

As part of IME’s Silicon Photonics Department, the successful candidate will play a key role in developing next-generation optical modulators based on Photonics Heterogeneous Integration (PHI), leveraging thin-film lithium niobate (TFLN) integrated with silicon photonics platforms. We are seeking highly motivated researchers and engineers to drive innovations in heterogeneously integrated photonic integrated circuits (PICs) for next-generation data communication and interconnect applications.

You will collaborate with a multidisciplinary team spanning photonics design, semiconductor process integration, advanced packaging, and wafer fabrication operations. By utilizing state-of-the-art industry-standard wafer-level manufacturing facilities, our team develops scalable photonic solutions with strong potential for high-volume manufacturing.

Key Responsibilities

• Lead the development and implementation of novel device concepts and designs for the heterogeneous integration of lithium niobate (LN) on 200 mm and 300 mm silicon-on-insulator (SOI) platforms.
• Develop product-ready TFLN-on-Silicon Photonics (SiPh) modulators targeting 400 Gbps-per-lane and beyond optical interconnect applications.
• Collaborate closely with photonics integration and process development teams to realize the co-integration of TFLN modulators and germanium (Ge) photodetectors on a common silicon photonics platform.
• Analyze and correlate in-line process data and off-line characterization results to understand the impact of process variations on device performance and yield.
• Drive device optimization, process integration, and technology maturation toward manufacturable solutions.
• Manage and execute R&D projects efficiently, accelerating development cycles while delivering value to internal and external stakeholders.
• Engage with industry partners, foundry ecosystems, and research collaborators to advance heterogeneous photonic integration technologies.

Long Description

Requirements

• PhD in Electrical Engineering, Physics, Materials Science, Photonics, Semiconductor Engineering, or a related discipline.
• Strong background in semiconductor device design, fabrication, or process integration.
• Experience in one or more of the following areas is highly desirable:
  • Thin-film lithium niobate (TFLN) modulators
  • Silicon photonics devices and integration
  • Heterogeneous integration and wafer bonding technologies
  • Electro-optic device design and characterization
  • Hands-on experience with Design of Experiments (DOE), statistical analysis, and data-driven optimization methodologies.
  • Familiarity with photonic simulation and design tools is an advantage.
• Excellent communication, technical presentation, and project management skills.
• Ability to work independently while collaborating effectively within multidisciplinary teams.

Additional Requirements for Senior Scientist Position

• Minimum 5 years of relevant industrial or research experience in semiconductor device design, photonic device development, or process integration.
• Demonstrated track record of technical leadership, project execution, and innovation in photonics or semiconductor technologies.