The Micro Electro Multiphysical systems (MEMS) team is looking for a MEMS fabrication process integrator. The research engineer will work with a multidisciplinary team to develop processes for the fabrication of MEMS-based ultrasonic transducer; RF devices and other devices based on piezo materials, such as PZT and ScAlN films.

Job Responsibilities:

• Work with design and process module team to develop integration platforms based on PZT, ScAlN films, and other piezo materials.
• Design integration process flows for up coming piezoelectric MEMS devices, design and execute DOEs to realize the devices.
• Conduct integration and fabrication of thin-film piezoelectric ultrasonic transducers, acoustic devices and RF devices.
• Manage wafer lot progress in the cleanroom, conduct inspection and characterization of MEMS devices/structures and failure analysis, using metrology tools such as DRSEM, CDSEM, ellipsometers, and microscopes.
• Communicate with internal and external customers on the project progress and manage the project execution.

JOB REQUIREMENTS

• BS/MS in Electronics Engineering/Chemical Engineering/Mechanical Engineering/Material Engineering/Applied Physics or equivalent.
• At least 3 years' experience in semiconductor process modules, integration or MEMS related modules and integration.
• Good knowledge and hands on experience on microfabricaon processes (e.g. etch, lithography, CMP, PVD and PECVD), process recipe tuning experience is a plus.
• Good knowledge and hands on experience on microfabricaon inspection and characterization methods, and data analysis of wafer-level measurements.
• Good communication and presentation skills, ability to work independently, as well as being an excellent team player.
• Continuously seeks opportunities to expand knowledge and skills, staying up to date with emerging trends and advancements in the field.
• Capable of conceptualizing and implementing creative approaches to address research questions and technology development.