Wafer-level 3D integration is becoming hot topic in industry. IME is running 3 wafer bonding projects. HI Dept.strongly needs someone to develop CMP module and relevant 2.5D/3D integration technology to meet industry demands and for future local value capture.
The new staff will be involved in all wafer bonding projects which requires CMP and relevant technologies such as backgrinding/polishing, wafer bonding, metrology/FA.
Bachelor / Masters in Mechanical / Electronic / Microelectronics or Engineering or related field
At least 3 to 5 years of working experience in CMP
Possess semiconductor back-end process knowledge