Job Description:
Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:
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Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
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Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
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Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
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File patents/know-hows on new development activities.
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Publish research findings in prestigious journals and conferences.
Job Requirement:
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Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
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Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
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Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
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Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
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Strong experimental design (DOE) and data analysis skills is preferred.
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Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
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At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
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Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
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Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.
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