Job Scope

• The candidate will be part of the Far-Backend of Line (Far-BEOL) process module team, advancing specialty microelectronics technologies at IME. His/Her main roles and responsibilities include:
• Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion, hybrid, thermocompression, and eutectic bonding for photonics heterogeneous integration and advanced packaging applications.
• Lead module loop integration for layer transfer of III-V and other compound materials through C2W bonding and post-processing.
• Drive innovations in process methodologies, materials, and approaches, and generate intellectual property related to heterogeneous integration platforms.
• Collaborate with industry partners to align on and develop the building blocks required for next-generation heterogeneous integration platforms, including equipment capabilities.
• Work closely with process integration teams to actively innovate, optimize bonding processes, and troubleshoot for industry and grant projects.
• Lead and support competitive grant research project proposals and oversee their successful execution.
• File patents and know-hows on new development activities.
• Actively document and publish research findings in prestigious journals and conferences.

Job Requirements

• PhD in Electronics, Microelectronics, Materials Engineering, Materials Science, Chemistry, Physics, or a related field.
• Minimum of 5 years' industry experience in 3D heterogeneous integration and wafer bonding technologies, gained in either an academic or industrial setting.
• Proven hands-on experience in wafer bonding with in-depth technical knowledge in at least one or more bonding processes and mechanisms (e.g., vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, temporary bonding).
• Knowledge of silicon photonics or 3D heterogeneous integration technology platforms is preferred.
• Strong skills in experimental design (DOE) and data analysis are preferred.
• Demonstrated interpersonal skills with proven ability to collaborate with internal and external stakeholders.
• At least 2 years of experience managing projects of moderate complexity is preferred.
• Strong oral and written communication skills, with the ability to deliver clear and concise messages to diverse stakeholders.
• Self-driven, with a strong interest in next-generation applications of wafer bonding technologies and awareness of industry trends.