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Job Description:
Research Engineer will be part of heterogeneous integration group focused on development of the advanced packaging technology platforms for multi-chip and high-density FOWLP. He/she will work on the following tasks:
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Process development for multi-chip and high density FOWLP for various applications such as Chiplets packaging for high power computing, Co-package Optics, Power devices etc.
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Plan and perform DOEs for various process development and materials evaluation for FOWLP
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Establish integration flows for advanced packages
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Coordinate and support engineering build of new packages and development
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Work with industry partners and multidisciplinary team members to execute assigned tasks and resolve issues for projects
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Publish new findings and technological advancement in prestigious journals and overseas/local conferences.
Job Requirements
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University degree or Masters in Electronics / Microelectronics / Material Engineering / Material Science / Chemistry / Physics.
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Prior experience in developing wafer level packaging and fan-out wafer level packaging
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Knowledge of advanced packaging technologies such as photolithography, ECP, PVD, plasma and wet etching is preferred
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Good analytical, communication and presentation skills
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