As an Equipment Engineer, you will own all assigned toolsets. The preferred candidate can troubleshoot difficult and poorly defined problems related to mechanics, electronics, and processes using tool knowledge/experience, SPC, schematics, and other available resources. The candidate will collaborate extensively with the area maintenance team and process engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.
Responsibilities:
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Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Main Stream Semiconductor Processes and Advanced Packaging processes. Highly desirable for a candidate to have a background in at least one of the following areas: Photolithography, PVD and CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology (some areas may be combined).
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Work with process engineering to drive root-cause corrective actions for equipment failures, implement permanent solutions, and eliminate chronic and long-term down events.
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Lead continuous improvement teams to drive tool matching, availability, and throughput improvements and reduce risk.
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Management of new tool installation, start-up, and tool upgrades to increase fab capability and capacity, lower costs, and improve yields.
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Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
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Participate in cross-functional teams that create efficiencies across all layers of the organization.
Required Qualifications
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Degree / Diploma with 10+ years of relevant Semiconductor Industry Experience in Mechanical, Electrical, or Chemical Engineering, Materials Science, Physics, or another relevant Engineering discipline.
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6+ years of experience within the respective areas of expertise. Experience should include one or more: Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, and Wet Chemistry.
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Demonstrated experience with the application of structured problem-solving methodology.
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Positive interpersonal skills, highly energetic and self-motivated.
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Demonstrated ability to meet requirements and deliver results.
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Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.
Preferred Qualifications
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Diploma or Bachelor of Science/Engineering in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant Engineering discipline.
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Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, Wet Chemistry.
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Positive interpersonal skills, highly energetic and self-motivated.
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Experience with Automated Fault Detection and Classification Systems (FDC).
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Strong background with utilizing SPC.
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High level of understanding of equipment component behaviour.
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Experience Integrating Equipment Maintenance Management Software
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